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ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
High Brightness SMT Round LED Lamps Amber, Red, Green and Blue Tinted LEDs
Data Sheet
Description
The new Avago ALMD-xx3D LED series has the same or just slightly less luminous intensity than conventional high brightness, through-hole LEDs. The new LED lamps can be assembled using common SMT assembly processes and are compatible with industrial reflow soldering processes. The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. For easy pick and place assembly, the LEDs are shipped in EIA-compliant tape and reel. Every reel is shipped from a single intensity and color bin- except the red color-for better uniformity.
Features
x Compact form factor x High brightness material x Available in Red, Amber, Green and Blue color x Red AlInGaP 626nm x Amber AlInGaP 590nm x Green InGaN 525nm x Blue InGaN 470nm x Jedec MSL 2A x Compatible with industrial reflow soldering process x Typical Viewing angle: 30 x Tinted, non-diffused
Package Dimensions
A A 4.20 0.20 C 4.20 0.20 4.75 0.50 C A: Anode C: Cathode
Applications
x Variable Message Signs
6.50 0.50
3.40 0.50
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.20 mm unless other specified.
2.50 0.20
1.4 (4x)
C
A 1.0
CAUTION: InGaN devices are Class 1C HBM ESD sensitive; AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
ALMD-EG3D-VX002 ALMD-EL3D-VX002 ALMD-CM3D-WY002 ALMD-CB3D-RT002
Color and Dominant Wavelength Od (nm) Typ [3]
Red 626 Amber 590 Green 525 Blue 470
Luminous Intensity Iv (mcd) [1,2,5] Min
4200 4200 5500 1500
Max
9300 9300 12000 3200
Viewing Angle Typ () [4]
30
Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. T1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is 15%
Part Numbering System
ALMD - X X 3D - x x x xx
Packaging Option
02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Untinted/Tinted Lens
D: Tinted
Viewing Angle
3: 30
Color
B: Blue G: Red L: Amber M: Green
Package
C: SMT Round Lamp InGaN E: SMT Round Lamp AlInGaP SMT Lamps
2
Absolute Maximum Rating, TJ = 25C
Parameter
DC Forward Current [1] Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Derate linearly as shown in Figure 4 and Figure 9 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz.
Red and Amber
50 100 [2] 120 5 (IR = 100 PA) 130 -40 to +85 -40 to +100
Blue and Green
30 100 [3] 114 5 (IR = 10 PA) 110
Unit
mA mA mW V C C C
Electrical / Optical Characteristics, TJ = 25C
Parameter
Forward Voltage Red Amber Green Blue Reverse Voltage Red & Amber Green & blue Dominant Wavelength [1] Red Amber Green Blue Peak Wavelength Red Amber Green Blue Thermal Resistance Luminous Efficacy [2] Red Amber Green Blue Thermal coefficient of Od Red Amber Green Blue
Symbol
VF
Min.
1.8 1.8 2.8 2.8
Typ.
2.1 2.1 3.2 3.2
Max.
2.4 2.4 3.8 3.8
Units
V
Test Conditions
IF = 20 mA
VR 5 5 Od 618.0 584.5 519.0 460.0 OPEAK 626.0 590.0 525.0 470.0 634 594 516 464 130 630.0 594.5 539.0 480.0 nm V
IF = 100 PA IF = 10 PA IF = 20 mA
Peak of Wavelength of Spectral Distribution at IF = 20 mA
RTJ-PIN
C/W
LED Junction-to-Pin
KV
200 520 530 65 0.059 0.103 0.028 0.024
lm/W
Emitted Luminous Power/Emitted Radiant Power
nm/C
IF = 20 mA ; +25C TJ +100C
Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt.
3
AlInGaP
1 FORWARD CURRENT - mA 0.8 RELATIVE INTENSITY 0.6 0.4 0.2 0 500 550 600 WAVELENGTH - nm 650 100 80 60 40 20 0
Amber
Red
0
0.5
1 1.5 2 FORWARD VOLTAGE - V
2.5
3
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20
60 MAXIMUM FORWARD CURRENT - mA 80 100 50 40 30 20 10 0 40 60 FORWARD CURRENT - mA 0 20 40 60 TA - AMBIENT TEMPERATURE (C) 80 100 Amber
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA)
Red
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6
RELATIVE DOMINANT WAVELENGTH SHIFT(NORMALIZED AT 20mA) - nm
Amber
Red
0
20
40 60 FORWARD CURRENT - mA
80
100
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
4
InGaN
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 BLUE 100 80 60 40 20 0 430 480 530 WAVELENGTH - nm 580 630 0 1 2 3 FORWARD VOLTAGE-V 4 5
GREEN
Figure 6. Relative Intensity vs Wavelength
Figure 7. Forward Current vs Forward Voltage
FORWARD CURRENT-mA Green
RELATIVE INTENSITY
3.5 Blue RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) IFmax - MAXIMUM FORWARD CURRENT - mA 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 DC FORWARD CURRENT-mA 100 120
35 30 25 20 15 10 5 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100
Figure 8. Relative Intensity vs Forward Current
Figure 9. Maximum Forward Current vs Ambient Temperature
10
RELATIVE DOMINANT WAVELENGTH SHIFT -nm
5
Green Blue
0
-5
-10
0
20
40 60 FORWARD CURRENT-mA
80
100
Figure 10. Dominant Wavelength Shift vs Forward Current
5
1.0 NORMALIZED INTENSITY 0.8 0.6 0.4 X 0.2 C 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE 60 90 Figure 11b. Component Axis for Radiation Pattern C A A X
Figure 11a. Radiation Pattern for X axis
10 NORMALZIED INTENSITY (PHOTO) FORWARD VOLTAGE SHIFT-V Red Amber Blue Green
0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -15 10 35 TJ - JUNCTION TEMPERATURE 60 85 Red Amber Green Blue
1
0.1
-40
-15
10 35 TJ - JUNCTION TEMPERATURE
60
85
Figure 12. Relative Intensity Shift vs Junction Temperature
Figure 13. Forward Voltage Shift vs Junction Temperature
6
2.1 5.2
Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum and above
Figure 14. Recommended Soldering Land Pattern
20 SEC. MAX. 10 to 30 SEC. TEMPERATURE TEMPERATURE 240C MAX. 3C/SEC. MAX. 100-150C 3C/SEC. MAX. 120 SEC. MAX. TIME Figure 16. Recommended Leaded Reflow Soldering Profile 60-150 SEC. 183C -6C/SEC. MAX. 255 - 260 C 3C/SEC. MAX. 6C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. TIME Figure 17. Recommended Pb- Free Reflow Soldering Profile 100 SEC. MAX.
0.7
4.0
217C 200C 150C
Note: For detail information on reflow soldering of Avago Surface Mount LED, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components.
7
0.400.05
4.000.10 2.000.10
1.550.10 1.750.10
1.800.20 7.500.10 5.200.10 2.200.20 4.500.10 5.300.10 7.100.10 8.000.10 16.000.30 1.600.10
Figure 18. Carrier Tape Dimension
+0.20
16.4 -0.00
LAB
1.5 MIN
13.000.20
O 1000.50 Anode O 330 MAX
Figure 19. Reel Dimension
Figure 20. Unit Orientation from reel 8
EL
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Intensity (mcd) at 20mA Bin
R S T U V W X Y Z
VF Bin Table (V at 20mA) for Red&Amber
Bin ID
VD VA VB
Min
1.8 2.0 2.2
Max
2.0 2.2 2.4
Min
1500 1900 2500 3200 4200 5500 7200 9300 12000
Max
1900 2500 3200 4200 5500 7200 9300 12000 16000
Tolerance for each bin limit is 0.05V
Tolerance for each bin limit is 15%
Red Color Range
Min Dom
618.0
Max Dom
630.0
X min
0.6872 0.6690
Y Min
0.3126 0.3149
X max
0.6890 0.7080
Y max
0.2943 0.2920
Tolerance for each bin limit is 0.5nm
Amber Color Range
Bin
1 2 4 6
Min Dom
584.5 587.0 589.5 592.0
Max Dom
587.0 589.5 592.0 594.5
Xmin
0.5420 0.5370 0.5570 0.5530 0.5720 0.5670 0.5870 0.5820
Ymin
0.4580 0.4550 0.4420 0.4400 0.4270 0.4250 0.4130 0.4110
Xmax
0.5530 0.5570 0.5670 0.5720 0.5820 0.5870 0.5950 0.6000
Ymax
0.4400 0.4420 0.4250 0.4270 0.4110 0.4130 0.3980 0.3990
Tolerance for each bin limit is 0.5nm
9
Green Color Range
Bin
1 2 3 4 5
Min Dom
519.0 523.0 527.0 531.0 535.0
Max Dom
523.0 527.0 531.0 535.0 539.0
Xmin
0.0667 0.1200 0.0979 0.1450 0.1305 0.1711 0.1625 0.1967 0.1929 0.2210
Ymin
0.8323 0.7375 0.8316 0.7319 0.8189 0.7218 0.8012 0.7077 0.7816 0.6920
Xmax
0.1450 0.0979 0.1711 0.1305 0.1967 0.1625 0.2210 0.1929 0.2445 0.2233
Ymax
0.7319 0.8316 0.7218 0.8189 0.7077 0.8012 0.6920 0.7816 0.6747 0.7600
Tolerance for each bin limit is 0.5nm
Blue Color Range
Bin
1 2 3 4 5
Min Dom
460.0 464.0 468.0 472.0 476.0
Max Dom
464.0 468.0 472.0 476.0 480.0
Xmin
0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517
Ymin
0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423
Xmax
0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913
Ymax
0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327
Tolerance for each bin limit is 0.5nm
10
Moisture Sensitivity and Handling
The ALMD-xx3D series oval package has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.
C. Control for unfinished tape and reel parts
x Unused LEDs must be stored in a sealed MBB with a desiccant or desiccator at < 5% RH.
D. Control of assembled boards
x If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours
A. Storage before use
x An unopened moisture barrier bag (MBB) can be stored at < 40 C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required then it is safe to reflow solder the LEDs per the original MSL rating. x It is recommended that the MBB not be opened prior to assembly (e.g. for IQC).
E. Baking is required if:
x The HIC indicator is not BROWN at 10% and is AZURE at 5% x The LEDs are exposed to a condition of > 30 C/60% RH at any time. x The LED floor life exceeded 672 hours. The recommended baking condition is: 60 5 C for 20 hours.
B. Control after opening the MBB
x The humidity indicator card (HIC) shall be read immediately upon opening of the MBB. x The LEDs must be kept at < 30 C/60% RH at all times, and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours.
DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-2372EN - March 22, 2010

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